Substrate with deposition and/or friction reduction coating

Substrate with deposition and/or friction reduction coating

The present disclosure may be directed towards a substrate with an array disposed thereon. The substrate comprising a bonding array with a plurality of bonding locations. A low emissivity layer is deposited on at least one side of the substrate and covers at least some of the bonding locations. The...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Hussey, Thomas, Whitby, Scott
Format: Patent
Sprache:eng
Schlagworte:
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:The present disclosure may be directed towards a substrate with an array disposed thereon. The substrate comprising a bonding array with a plurality of bonding locations. A low emissivity layer is deposited on at least one side of the substrate and covers at least some of the bonding locations. The low emissivity layer may be a metal layer which functions as a radiant barrier.