Apparatus for electro-chemical plating
An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged...
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| creator | Lin, Ming-Hsien Hou, Kuo-Lung Wu, Tsung-Cheng |
| description | An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12071699B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12071699B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12071699B23</originalsourceid><addsrcrecordid>eNrjZFBzLChILEosKS1WSMsvUkjNSU0uKcrXTc5Izc1MTsxRKMhJLMnMS-dhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYZGBuaGZpaWTkbGxKgBAIEpJ98</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Apparatus for electro-chemical plating</title><source>esp@cenet</source><creator>Lin, Ming-Hsien ; Hou, Kuo-Lung ; Wu, Tsung-Cheng</creator><creatorcontrib>Lin, Ming-Hsien ; Hou, Kuo-Lung ; Wu, Tsung-Cheng</creatorcontrib><description>An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240827&DB=EPODOC&CC=US&NR=12071699B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240827&DB=EPODOC&CC=US&NR=12071699B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lin, Ming-Hsien</creatorcontrib><creatorcontrib>Hou, Kuo-Lung</creatorcontrib><creatorcontrib>Wu, Tsung-Cheng</creatorcontrib><title>Apparatus for electro-chemical plating</title><description>An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBzLChILEosKS1WSMsvUkjNSU0uKcrXTc5Izc1MTsxRKMhJLMnMS-dhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYZGBuaGZpaWTkbGxKgBAIEpJ98</recordid><startdate>20240827</startdate><enddate>20240827</enddate><creator>Lin, Ming-Hsien</creator><creator>Hou, Kuo-Lung</creator><creator>Wu, Tsung-Cheng</creator><scope>EVB</scope></search><sort><creationdate>20240827</creationdate><title>Apparatus for electro-chemical plating</title><author>Lin, Ming-Hsien ; Hou, Kuo-Lung ; Wu, Tsung-Cheng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12071699B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>Lin, Ming-Hsien</creatorcontrib><creatorcontrib>Hou, Kuo-Lung</creatorcontrib><creatorcontrib>Wu, Tsung-Cheng</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lin, Ming-Hsien</au><au>Hou, Kuo-Lung</au><au>Wu, Tsung-Cheng</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Apparatus for electro-chemical plating</title><date>2024-08-27</date><risdate>2024</risdate><abstract>An electrochemical plating apparatus for depositing a conductive material on a wafer includes a cell chamber. The plating solution is provided from a bottom of the cell chamber into the cell chamber. A plurality of openings passes through a sidewall of the cell chamber. A flow regulator is arranged with each of the plurality of openings configured to regulate an overflow amount of the plating solution flowing out through the each of the plurality of openings. The electrochemical plating apparatus further comprises a controller to control the flow regulator such that overflow amounts of the plating solution flowing out through the plurality of openings are substantially equal to each other.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Apparatus for electro-chemical plating |
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