Die bonding apparatus and manufacturing method for semiconductor device

A die bonding apparatus includes: a driven body; and a table for driving the driven body. The table includes: a base; a linear motor having a first mover that moves the driven body, and a stator; a first linear motion guide that is provided between the base and the stator and capable of freely movin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Mochizuki, Masayuki, Saegusa, Ryo, Yamamoto, Keita
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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