Chip transfer apparatus

A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including...

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Hauptverfasser: Park, Joonyong, Hwang, Kyungwook, Kim, Hyunjoon, Kim, Dongkyun, Hong, Seogwoo
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Sprache:eng
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creator Park, Joonyong
Hwang, Kyungwook
Kim, Hyunjoon
Kim, Dongkyun
Hong, Seogwoo
description A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12068178B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12068178B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12068178B23</originalsourceid><addsrcrecordid>eNrjZBB3zsgsUCgpSswrTkstUkgsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYZGBmYWhuYWTkbGxKgBANX5Ii4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Chip transfer apparatus</title><source>esp@cenet</source><creator>Park, Joonyong ; Hwang, Kyungwook ; Kim, Hyunjoon ; Kim, Dongkyun ; Hong, Seogwoo</creator><creatorcontrib>Park, Joonyong ; Hwang, Kyungwook ; Kim, Hyunjoon ; Kim, Dongkyun ; Hong, Seogwoo</creatorcontrib><description>A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CONVEYING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HANDLING THIN OR FILAMENTARY MATERIAL ; PACKING ; PERFORMING OPERATIONS ; PNEUMATIC TUBE CONVEYORS ; SEMICONDUCTOR DEVICES ; SHOP CONVEYOR SYSTEMS ; STORING ; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240820&amp;DB=EPODOC&amp;CC=US&amp;NR=12068178B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240820&amp;DB=EPODOC&amp;CC=US&amp;NR=12068178B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Park, Joonyong</creatorcontrib><creatorcontrib>Hwang, Kyungwook</creatorcontrib><creatorcontrib>Kim, Hyunjoon</creatorcontrib><creatorcontrib>Kim, Dongkyun</creatorcontrib><creatorcontrib>Hong, Seogwoo</creatorcontrib><title>Chip transfer apparatus</title><description>A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CONVEYING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HANDLING THIN OR FILAMENTARY MATERIAL</subject><subject>PACKING</subject><subject>PERFORMING OPERATIONS</subject><subject>PNEUMATIC TUBE CONVEYORS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHOP CONVEYOR SYSTEMS</subject><subject>STORING</subject><subject>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB3zsgsUCgpSswrTkstUkgsKEgsSiwpLeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYZGBmYWhuYWTkbGxKgBANX5Ii4</recordid><startdate>20240820</startdate><enddate>20240820</enddate><creator>Park, Joonyong</creator><creator>Hwang, Kyungwook</creator><creator>Kim, Hyunjoon</creator><creator>Kim, Dongkyun</creator><creator>Hong, Seogwoo</creator><scope>EVB</scope></search><sort><creationdate>20240820</creationdate><title>Chip transfer apparatus</title><author>Park, Joonyong ; Hwang, Kyungwook ; Kim, Hyunjoon ; Kim, Dongkyun ; Hong, Seogwoo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12068178B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CONVEYING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HANDLING THIN OR FILAMENTARY MATERIAL</topic><topic>PACKING</topic><topic>PERFORMING OPERATIONS</topic><topic>PNEUMATIC TUBE CONVEYORS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHOP CONVEYOR SYSTEMS</topic><topic>STORING</topic><topic>TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Park, Joonyong</creatorcontrib><creatorcontrib>Hwang, Kyungwook</creatorcontrib><creatorcontrib>Kim, Hyunjoon</creatorcontrib><creatorcontrib>Kim, Dongkyun</creatorcontrib><creatorcontrib>Hong, Seogwoo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Park, Joonyong</au><au>Hwang, Kyungwook</au><au>Kim, Hyunjoon</au><au>Kim, Dongkyun</au><au>Hong, Seogwoo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Chip transfer apparatus</title><date>2024-08-20</date><risdate>2024</risdate><abstract>A chip transfer apparatus includes: a chip storage module in which a plurality of micro-semiconductor chips and a suspension including impurities are stored; a chip filtration module separating a first suspension including the plurality of micro-semiconductor chips and a second suspension including the impurities in the suspension; and a chip supply module configured to supply the first suspension onto the transfer substrate such that the first suspension is introduced from the chip filtration module and the plurality of micro-semiconductor chips are flowable on the transfer substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
PACKING
PERFORMING OPERATIONS
PNEUMATIC TUBE CONVEYORS
SEMICONDUCTOR DEVICES
SHOP CONVEYOR SYSTEMS
STORING
TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING
TRANSPORTING
title Chip transfer apparatus
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T16%3A35%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Park,%20Joonyong&rft.date=2024-08-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS12068178B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true