Method of manufacturing electronic component

A method of manufacturing an electronic component includes preparing an unfired multilayer body, bonding one of first and second side surfaces of each unfired multilayer body to an adhesive sheet such that the unfired multilayer bodies are in at least one row, polishing the other side surface of eac...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Sumi, Akira
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE ELECTRICITY
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