Packaging material for molding

A packaging material for molding includes a heat resistant resin layer as an outer layer; a thermoplastic resin layer as an inner layer; a metal foil layer disposed between the heat resistant resin layer and the thermoplastic resin layer; a first adhesive layer disposed between the metal foil layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Kawakita, Keitaro, Minamibori, Yuji
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY TRANSPORTING USE OF MATERIALS AS ADHESIVES
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