Semiconductor package and method of manufacturing the same

A method of manufacturing a semiconductor package includes forming an encapsulated semiconductor device and forming a redistribution structure over the encapsulated semiconductor device, where the encapsulated semiconductor device includes a semiconductor device encapsulated by an encapsulating mate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lin, Chiang, Tseng, Hua-Wei, Yeh, Ming-Shih, Huang, Li-Hsien, Su, An-Jhih, Yeh, Der-Chyang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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