Method of producing a substrate and system for producing a substrate

The invention relates to a method of producing a substrate. The method comprises providing a workpiece having a first surface and a second surface opposite the first surface, and providing a carrier having a first surface and a second surface opposite the first surface. The method further comprises...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Priewasser, Karl Heinz
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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Beschreibung
Zusammenfassung:	The invention relates to a method of producing a substrate. The method comprises providing a workpiece having a first surface and a second surface opposite the first surface, and providing a carrier having a first surface and a second surface opposite the first surface. The method further comprises attaching the carrier to the workpiece, wherein at least a peripheral portion of the first surface of the carrier is attached to the first surface of the workpiece, and forming a modified layer inside the workpiece. Moreover, the method comprises dividing the workpiece along the modified layer, thereby obtaining the substrate, wherein the substrate has the carrier attached thereto, and removing carrier material from the side of the second surface of the carrier in a central portion of the carrier so as to form a recess in the carrier. The invention further relates to a substrate producing system for performing this method.