Method of bonding substrates utilizing a substrate holder with holding fingers

A substrate bonding apparatus includes a substrate susceptor to support a first substrate, a substrate holder over the substrate susceptor to hold a second substrate, the substrate holder including a plurality of independently moveable holding fingers, and a chamber housing to accommodate the substr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, Tae-yeong, Kim, Sung-hyup, Kim, Jun-hyung
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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