Semiconductor devices and methods of manufacturing semiconductor devices
In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna s...
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| creator | Reichman, Corey Oh, Se Man Kim, Byong Jin Lee, Kyoung Yeon |
| description | In one example, a semiconductor device, includes a substrate having a substrate top side, a substrate bottom side, a substrate dielectric structure, and a substrate conductive structure. The substrate conductive structure includes a transceiver pattern proximate to a substrate top side. An antenna structure includes an antenna dielectric structure coupled to the substrate top side, an antenna conductive structure having an antenna element, and a cavity below the antenna element. The antenna element overlies the transceiver pattern. The cavity includes a cavity ceiling, a cavity base, and a cavity sidewall between the cavity ceiling and the cavity base. Either a bottom surface of the antenna element defines the cavity ceiling and a perimeter portion of the antenna element is fixed to the antenna dielectric structure, or the antenna dielectric structure includes a body portion having a bottom surface that defines the cavity ceiling and the antenna element is vertically spaced apart from the bottom surface of the body portion. An semiconductor component is coupled to a bottom side of the substrate and is coupled to the transceiver pattern. Other examples and related methods are also disclosed herein. |
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| subjects | ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Semiconductor devices and methods of manufacturing semiconductor devices |
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