Methods of fabricating semiconductor package

Methods of fabricating a semiconductor package may include forming a first barrier layer on a first carrier, forming a sacrificial layer, including an opening that exposes at least a portion of the first barrier layer, on the first barrier layer, and forming a second barrier layer on the first barri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Park, Jung-Ho, Jang, Jae Gwon, Park, Jin-Woo, Jeon, Gwang Jae
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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