Wafer cleaning apparatus and wafer cleaning method using the same
A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiat...
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| creator | Kim, Young-Hoo Lee, Kun Tack Cha, Ji Hoon Kim, Seok Hoon Choi, Yong Jun Jang, Hun Jae Kim, Tae-Hong Shin, Seung Min Kim, In Gi |
| description | A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%. |
| format | Patent |
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The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLEANING ; CLEANING IN GENERAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; PREVENTION OF FOULING IN GENERAL ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240723&DB=EPODOC&CC=US&NR=12042828B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240723&DB=EPODOC&CC=US&NR=12042828B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Kim, Young-Hoo</creatorcontrib><creatorcontrib>Lee, Kun Tack</creatorcontrib><creatorcontrib>Cha, Ji Hoon</creatorcontrib><creatorcontrib>Kim, Seok Hoon</creatorcontrib><creatorcontrib>Choi, Yong Jun</creatorcontrib><creatorcontrib>Jang, Hun Jae</creatorcontrib><creatorcontrib>Kim, Tae-Hong</creatorcontrib><creatorcontrib>Shin, Seung Min</creatorcontrib><creatorcontrib>Kim, In Gi</creatorcontrib><title>Wafer cleaning apparatus and wafer cleaning method using the same</title><description>A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLEANING</subject><subject>CLEANING IN GENERAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PREVENTION OF FOULING IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMT0xLLVJIzklNzMvMS1dILChILEosKS1WSMxLUShHlcxNLcnIT1EoLQZxSjJSFYoTc1N5GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakl8aLChkYGJkYWRhZORMTFqAOzpMZA</recordid><startdate>20240723</startdate><enddate>20240723</enddate><creator>Kim, Young-Hoo</creator><creator>Lee, Kun Tack</creator><creator>Cha, Ji Hoon</creator><creator>Kim, Seok Hoon</creator><creator>Choi, Yong Jun</creator><creator>Jang, Hun Jae</creator><creator>Kim, Tae-Hong</creator><creator>Shin, Seung Min</creator><creator>Kim, In Gi</creator><scope>EVB</scope></search><sort><creationdate>20240723</creationdate><title>Wafer cleaning apparatus and wafer cleaning method using the same</title><author>Kim, Young-Hoo ; Lee, Kun Tack ; Cha, Ji Hoon ; Kim, Seok Hoon ; Choi, Yong Jun ; Jang, Hun Jae ; Kim, Tae-Hong ; Shin, Seung Min ; Kim, In Gi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12042828B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLEANING</topic><topic>CLEANING IN GENERAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PREVENTION OF FOULING IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Kim, Young-Hoo</creatorcontrib><creatorcontrib>Lee, Kun Tack</creatorcontrib><creatorcontrib>Cha, Ji Hoon</creatorcontrib><creatorcontrib>Kim, Seok Hoon</creatorcontrib><creatorcontrib>Choi, Yong Jun</creatorcontrib><creatorcontrib>Jang, Hun Jae</creatorcontrib><creatorcontrib>Kim, Tae-Hong</creatorcontrib><creatorcontrib>Shin, Seung Min</creatorcontrib><creatorcontrib>Kim, In Gi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Kim, Young-Hoo</au><au>Lee, Kun Tack</au><au>Cha, Ji Hoon</au><au>Kim, Seok Hoon</au><au>Choi, Yong Jun</au><au>Jang, Hun Jae</au><au>Kim, Tae-Hong</au><au>Shin, Seung Min</au><au>Kim, In Gi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer cleaning apparatus and wafer cleaning method using the same</title><date>2024-07-23</date><risdate>2024</risdate><abstract>A wafer cleaning apparatus is provided. The wafer cleaning apparatus includes comprising a chamber configured to be loaded with a wafer, a nozzle on the wafer and configured to provide liquid chemicals on an upper surface of the wafer, a housing under the wafer, a laser module configured to irradiate laser on the wafer, a transparent window disposed between the wafer and the laser module, and a controller configured to control on/off of the laser module, wherein the controller is configured to control repetition of turning the laser module on and off, and retain temperature of the wafer within a temperature range, and a ratio of time when the laser module is on in one cycle including on/off of the laser module is 30% to 50%.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLEANING CLEANING IN GENERAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Wafer cleaning apparatus and wafer cleaning method using the same |
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