Mounting method and mounting structure formed by the same

A method for mounting an electronic component on a resin base material, the method including:(1) preparing the resin base material having a wiring pattern formed of a conductive paste;(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a...

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Bibliographische Detailangaben
Hauptverfasser:	Matsuno, Koso, Ohashi, Naomichi, Okawa, Yasuhiro
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for mounting an electronic component on a resin base material, the method including:(1) preparing the resin base material having a wiring pattern formed of a conductive paste;(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;(3) placing the electronic component on the solder paste; and(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, whereina melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.