Electronic package and carrier thereof and method for manufacturing the same

Electronic package and carrier thereof and method for manufacturing the same

An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By c...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Lin, Chang-Fu, Jiang, Don-Son, Chang, Po-Yung, Chen, Chi-Ren, Hsu, Yuan-Hung, Weng, Pei-Geng
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic package is provided and includes a carrier for carrying electronic components. Electrical contact pads of the carrier for planting solder balls are connected with a plurality of columnar conductors, and the conductors are electrically connected to a circuit portion in the carrier. By connecting a plurality of conductors with a single electrical contact pad, structural stress can be distributed and breakage of the circuit portion can be prevented.