Semiconductor package and method of manufacturing the same

A method of manufacturing a semiconductor package includes preparing a wafer structure having a first semiconductor substrate and a plurality of first front surface connection pads. A lower semiconductor chip having a preliminary semiconductor substrate and a plurality of second front surface connec...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Seo, Sunkyoung, Kim, Juhyeon, Kim, Hyoeun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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