Semiconductor device including a semiconductor die and a plurality of antenna patterns

A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, a heat dissipation element and conductive balls. The insulating encapsulant is encapsulating the semiconductor die, and has a first surface and a second surface o...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Hsu, Sen-Kuei, Pan, Hsin-Yu, Chiang, Yi-Che
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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