Hybrid device assemblies and method of fabrication

A device assembly includes a functional substrate having one or more electronic components formed there. The functional substrate has a cavity extending from a first surface toward a second surface of the functional substrate at a location that lacks the electronic components. The device assembly fu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Viswanathan, Lakshminarayan, Jones, Jeffrey Kevin, Li, Li
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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