Composite interposer structure and method of providing same

Techniques and mechanisms for high interconnect density communication with an interposer. In some embodiments, an interposer comprises a substrate and portions disposed thereon, wherein respective inorganic dielectrics of said portions adjoin each other at a material interface, which extends to each...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liff, Shawna, Swan, Johanna, Elsherbini, Adel, Pasdast, Gerald
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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