Fiber composites comprising a circuit, and method therefor

Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compressio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Mathews, Andrew, Perkins, J. Scott, Escowitz, Ethan, Reese, Riley
Format: Patent
Sprache:eng
Schlagworte:
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