Fiber composites comprising a circuit, and method therefor

Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compressio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Mathews, Andrew, Perkins, J. Scott, Escowitz, Ethan, Reese, Riley
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Mathews, Andrew
Perkins, J. Scott
Escowitz, Ethan
Reese, Riley
description Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US12011854B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US12011854B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US12011854B23</originalsourceid><addsrcrecordid>eNrjZLByy0xKLVJIzs8tyC_OLEktBjOLMosz89IVEhWSM4uSSzNLdBQS81IUclNLMvJTFEoyUotS0_KLeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJfGiwoZGBoaGFqYmTkTExagB3xC8d</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Fiber composites comprising a circuit, and method therefor</title><source>esp@cenet</source><creator>Mathews, Andrew ; Perkins, J. Scott ; Escowitz, Ethan ; Reese, Riley</creator><creatorcontrib>Mathews, Andrew ; Perkins, J. Scott ; Escowitz, Ethan ; Reese, Riley</creatorcontrib><description>Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.</description><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER ; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ; ELECTRICITY ; GENERATION ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; PERFORMING OPERATIONS ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; SYSTEMS FOR STORING ELECTRIC ENERGY ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240618&amp;DB=EPODOC&amp;CC=US&amp;NR=12011854B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240618&amp;DB=EPODOC&amp;CC=US&amp;NR=12011854B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Mathews, Andrew</creatorcontrib><creatorcontrib>Perkins, J. Scott</creatorcontrib><creatorcontrib>Escowitz, Ethan</creatorcontrib><creatorcontrib>Reese, Riley</creatorcontrib><title>Fiber composites comprising a circuit, and method therefor</title><description>Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER</subject><subject>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</subject><subject>ELECTRICITY</subject><subject>GENERATION</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>PERFORMING OPERATIONS</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>SYSTEMS FOR STORING ELECTRIC ENERGY</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLByy0xKLVJIzs8tyC_OLEktBjOLMosz89IVEhWSM4uSSzNLdBQS81IUclNLMvJTFEoyUotS0_KLeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJfGiwoZGBoaGFqYmTkTExagB3xC8d</recordid><startdate>20240618</startdate><enddate>20240618</enddate><creator>Mathews, Andrew</creator><creator>Perkins, J. Scott</creator><creator>Escowitz, Ethan</creator><creator>Reese, Riley</creator><scope>EVB</scope></search><sort><creationdate>20240618</creationdate><title>Fiber composites comprising a circuit, and method therefor</title><author>Mathews, Andrew ; Perkins, J. Scott ; Escowitz, Ethan ; Reese, Riley</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US12011854B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER</topic><topic>CONVERSION OR DISTRIBUTION OF ELECTRIC POWER</topic><topic>ELECTRICITY</topic><topic>GENERATION</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>PERFORMING OPERATIONS</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>SYSTEMS FOR STORING ELECTRIC ENERGY</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>Mathews, Andrew</creatorcontrib><creatorcontrib>Perkins, J. Scott</creatorcontrib><creatorcontrib>Escowitz, Ethan</creatorcontrib><creatorcontrib>Reese, Riley</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mathews, Andrew</au><au>Perkins, J. Scott</au><au>Escowitz, Ethan</au><au>Reese, Riley</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Fiber composites comprising a circuit, and method therefor</title><date>2024-06-18</date><risdate>2024</risdate><abstract>Fiber-composite parts that incorporate a very thin electrical circuit, and a method for making the parts via compression molding, are disclosed. The electrical circuit is encapsulated by a film having a melting point that exceeds the maximum temperature to which the film is exposed during compression molding. The electrical circuit is disposed in a composite ply, in a lay-up of composite plies, and electrical leads are routed through the composite plies so that the lead are accessible in the molded fiber-composite part.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US12011854B2
source esp@cenet
subjects AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER
CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
ELECTRICITY
GENERATION
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
PERFORMING OPERATIONS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
SYSTEMS FOR STORING ELECTRIC ENERGY
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
title Fiber composites comprising a circuit, and method therefor
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T08%3A53%3A03IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Mathews,%20Andrew&rft.date=2024-06-18&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS12011854B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true