Component carrier structure connectable by electrically conductive connection medium in recess with cavity having surface profile

A component carrier with a first component carrier structure including a first stack which has at least one first electrically conductive layer structure and at least one first electrically insulating layer structure is disclosed. The at least one first electrically conductive layer structure has a...

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Bibliographische Detailangaben

1. Verfasser:	Ifis, Abderrazzaq
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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