Interconnect structure and manufacturing method for the same

The present disclosure provides an interconnect structure, including a first metal line, a second metal line spaced away from the first metal line, a conductive contact over the first metal line, including a first portion, a second portion over the first portion, wherein a bottom width of the second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wu, Chia-Tien, Yang, Tai-I, Liu, Hsiang-Wei, Chu, Wei-Chen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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