Cooler and semiconductor apparatus

A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumf...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Koyama, Takahiro, Gohara, Hiromichi, Tateishi, Yoshihiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Koyama, Takahiro Gohara, Hiromichi Tateishi, Yoshihiro
description	A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11996350B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11996350B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11996350B23</originalsourceid><addsrcrecordid>eNrjZFByzs_PSS1SSMxLUShOzc1Mzs9LKU0uyQeKFBQkFiWWlBbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDQ0tLM2NTAycjY2LUAADReSaI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Cooler and semiconductor apparatus</title><source>esp@cenet</source><creator>Koyama, Takahiro ; Gohara, Hiromichi ; Tateishi, Yoshihiro</creator><creatorcontrib>Koyama, Takahiro ; Gohara, Hiromichi ; Tateishi, Yoshihiro</creatorcontrib><description>A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240528&DB=EPODOC&CC=US&NR=11996350B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240528&DB=EPODOC&CC=US&NR=11996350B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Koyama, Takahiro</creatorcontrib><creatorcontrib>Gohara, Hiromichi</creatorcontrib><creatorcontrib>Tateishi, Yoshihiro</creatorcontrib><title>Cooler and semiconductor apparatus</title><description>A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFByzs_PSS1SSMxLUShOzc1Mzs9LKU0uyQeKFBQkFiWWlBbzMLCmJeYUp_JCaW4GRTfXEGcP3dSC_PjU4oLE5NS81JL40GBDQ0tLM2NTAycjY2LUAADReSaI</recordid><startdate>20240528</startdate><enddate>20240528</enddate><creator>Koyama, Takahiro</creator><creator>Gohara, Hiromichi</creator><creator>Tateishi, Yoshihiro</creator><scope>EVB</scope></search><sort><creationdate>20240528</creationdate><title>Cooler and semiconductor apparatus</title><author>Koyama, Takahiro ; Gohara, Hiromichi ; Tateishi, Yoshihiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11996350B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Koyama, Takahiro</creatorcontrib><creatorcontrib>Gohara, Hiromichi</creatorcontrib><creatorcontrib>Tateishi, Yoshihiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Koyama, Takahiro</au><au>Gohara, Hiromichi</au><au>Tateishi, Yoshihiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cooler and semiconductor apparatus</title><date>2024-05-28</date><risdate>2024</risdate><abstract>A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US11996350B2
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	Cooler and semiconductor apparatus
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-15T10%3A32%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Koyama,%20Takahiro&rft.date=2024-05-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11996350B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true