Dual micro-electro mechanical system and manufacturing method thereof
A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.
Gespeichert in:
Hauptverfasser: | , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Tseng, Huang-Wen Chen, Yang-Che Teng, Yi-Chuan Lin, Chen-Hua Liang, Victor Chiang Liu, Chwen-Ming |
description | A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11993512B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11993512B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11993512B23</originalsourceid><addsrcrecordid>eNrjZHB1KU3MUcjNTC7K103NSU0uKcpXyE1NzkjMy0wGShRXFpek5iok5qUo5CbmlaYlJpeUFmXmpQPVlGTkpyiUZKQWpean8TCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQ0NLS2NTQyMnI2Ni1AAAGVwzuA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Dual micro-electro mechanical system and manufacturing method thereof</title><source>esp@cenet</source><creator>Tseng, Huang-Wen ; Chen, Yang-Che ; Teng, Yi-Chuan ; Lin, Chen-Hua ; Liang, Victor Chiang ; Liu, Chwen-Ming</creator><creatorcontrib>Tseng, Huang-Wen ; Chen, Yang-Che ; Teng, Yi-Chuan ; Lin, Chen-Hua ; Liang, Victor Chiang ; Liu, Chwen-Ming</creatorcontrib><description>A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.</description><language>eng</language><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240528&DB=EPODOC&CC=US&NR=11993512B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240528&DB=EPODOC&CC=US&NR=11993512B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tseng, Huang-Wen</creatorcontrib><creatorcontrib>Chen, Yang-Che</creatorcontrib><creatorcontrib>Teng, Yi-Chuan</creatorcontrib><creatorcontrib>Lin, Chen-Hua</creatorcontrib><creatorcontrib>Liang, Victor Chiang</creatorcontrib><creatorcontrib>Liu, Chwen-Ming</creatorcontrib><title>Dual micro-electro mechanical system and manufacturing method thereof</title><description>A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.</description><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB1KU3MUcjNTC7K103NSU0uKcpXyE1NzkjMy0wGShRXFpek5iok5qUo5CbmlaYlJpeUFmXmpQPVlGTkpyiUZKQWpean8TCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSS-NBgQ0NLS2NTQyMnI2Ni1AAAGVwzuA</recordid><startdate>20240528</startdate><enddate>20240528</enddate><creator>Tseng, Huang-Wen</creator><creator>Chen, Yang-Che</creator><creator>Teng, Yi-Chuan</creator><creator>Lin, Chen-Hua</creator><creator>Liang, Victor Chiang</creator><creator>Liu, Chwen-Ming</creator><scope>EVB</scope></search><sort><creationdate>20240528</creationdate><title>Dual micro-electro mechanical system and manufacturing method thereof</title><author>Tseng, Huang-Wen ; Chen, Yang-Che ; Teng, Yi-Chuan ; Lin, Chen-Hua ; Liang, Victor Chiang ; Liu, Chwen-Ming</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11993512B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Tseng, Huang-Wen</creatorcontrib><creatorcontrib>Chen, Yang-Che</creatorcontrib><creatorcontrib>Teng, Yi-Chuan</creatorcontrib><creatorcontrib>Lin, Chen-Hua</creatorcontrib><creatorcontrib>Liang, Victor Chiang</creatorcontrib><creatorcontrib>Liu, Chwen-Ming</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tseng, Huang-Wen</au><au>Chen, Yang-Che</au><au>Teng, Yi-Chuan</au><au>Lin, Chen-Hua</au><au>Liang, Victor Chiang</au><au>Liu, Chwen-Ming</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Dual micro-electro mechanical system and manufacturing method thereof</title><date>2024-05-28</date><risdate>2024</risdate><abstract>A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_US11993512B2 |
source | esp@cenet |
subjects | MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING |
title | Dual micro-electro mechanical system and manufacturing method thereof |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-25T22%3A36%3A24IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Tseng,%20Huang-Wen&rft.date=2024-05-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11993512B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |