Method of manufacturing a light emitting device

A method of manufacturing a light emitting device includes disposing at least one light emitting element on a recessed part of a resin package. The resin package having the recessed part includes a resin molding with a white pigment having a particle size from 0.1 μm to 50 μm and at least one lead e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Yuasa, Kanako, Urasaki, Naoyuki
Format: Patent
Sprache:eng
Schlagworte:
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