FOUP or cassette storage for hybrid substrate bonding system

Embodiments of equipment front end modules (EFEMs) are provided herein. In some embodiments, an EFEM includes: two or more loadports for receiving two or more types of substrates; an overhead storage unit having a plurality of storage shelves disposed above the two or more loadports and configured t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bhimjiyani, Jitendra Ratilal, Shantaram, Avinash, Wang, Ruiping, Grove, Coby Scott
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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