Chemical supply apparatus, method for removing particles from chemical, nozzle unit, and substrate treating apparatus

A chemical supply apparatus includes an evaporation unit disposed downstream of a chemical supply source to vaporize supplied chemical thereto, a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the vaporized chemical while the vaporized chemical...

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Bibliographische Detailangaben
Hauptverfasser:	Hong, Yong Hoon, Lee, Ji Young, Kim, Heehwan, Kim, Young Su, Yoon, Dohyeon
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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