Method of manufacturing substrate structure with filling material formed in concave portion

Provided is a substrate structure including a substrate body, electrical contact pads and an insulating protection layer disposed on the substrate body, wherein the insulating protection layer has openings exposing the electrical contact pads, and at least one of the electrical contact pads has at l...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lin, Chang-Fu, Yao, Chin-Tsai, Lin, Chun-Tang, Huang, Fu-Tang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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