Fan-out package having a main die and a dummy die

Fan-out package having a main die and a dummy die

A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plural...

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Hauptverfasser: Wu, Wei-Cheng, Lin, Yan-Fu, Yu, Chen-Hua, Chen, Hsien-Wei, Lee, Meng-Tsan
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Wu, Wei-Cheng
Lin, Yan-Fu
Yu, Chen-Hua
Chen, Hsien-Wei
Lee, Meng-Tsan
description A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11967563B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11967563B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11967563B23</originalsourceid><addsrcrecordid>eNrjZDB0S8zTzS8tUShITM5OTE9VyEgsy8xLV0hUyE3MzFNIyUxVSMxLAXJTSnNzK0F8HgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWgw0JzUvtSQ-NNjQ0NLM3NTM2MnImBg1AAIPKoU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Fan-out package having a main die and a dummy die</title><source>esp@cenet</source><creator>Wu, Wei-Cheng ; Lin, Yan-Fu ; Yu, Chen-Hua ; Chen, Hsien-Wei ; Lee, Meng-Tsan</creator><creatorcontrib>Wu, Wei-Cheng ; Lin, Yan-Fu ; Yu, Chen-Hua ; Chen, Hsien-Wei ; Lee, Meng-Tsan</creatorcontrib><description>A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240423&amp;DB=EPODOC&amp;CC=US&amp;NR=11967563B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240423&amp;DB=EPODOC&amp;CC=US&amp;NR=11967563B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Wu, Wei-Cheng</creatorcontrib><creatorcontrib>Lin, Yan-Fu</creatorcontrib><creatorcontrib>Yu, Chen-Hua</creatorcontrib><creatorcontrib>Chen, Hsien-Wei</creatorcontrib><creatorcontrib>Lee, Meng-Tsan</creatorcontrib><title>Fan-out package having a main die and a dummy die</title><description>A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB0S8zTzS8tUShITM5OTE9VyEgsy8xLV0hUyE3MzFNIyUxVSMxLAXJTSnNzK0F8HgbWtMSc4lReKM3NoOjmGuLsoZtakB-fWgw0JzUvtSQ-NNjQ0NLM3NTM2MnImBg1AAIPKoU</recordid><startdate>20240423</startdate><enddate>20240423</enddate><creator>Wu, Wei-Cheng</creator><creator>Lin, Yan-Fu</creator><creator>Yu, Chen-Hua</creator><creator>Chen, Hsien-Wei</creator><creator>Lee, Meng-Tsan</creator><scope>EVB</scope></search><sort><creationdate>20240423</creationdate><title>Fan-out package having a main die and a dummy die</title><author>Wu, Wei-Cheng ; Lin, Yan-Fu ; Yu, Chen-Hua ; Chen, Hsien-Wei ; Lee, Meng-Tsan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11967563B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Wu, Wei-Cheng</creatorcontrib><creatorcontrib>Lin, Yan-Fu</creatorcontrib><creatorcontrib>Yu, Chen-Hua</creatorcontrib><creatorcontrib>Chen, Hsien-Wei</creatorcontrib><creatorcontrib>Lee, Meng-Tsan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Wu, Wei-Cheng</au><au>Lin, Yan-Fu</au><au>Yu, Chen-Hua</au><au>Chen, Hsien-Wei</au><au>Lee, Meng-Tsan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Fan-out package having a main die and a dummy die</title><date>2024-04-23</date><risdate>2024</risdate><abstract>A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Fan-out package having a main die and a dummy die
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T00%3A33%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Wu,%20Wei-Cheng&rft.date=2024-04-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11967563B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true