Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first plurality of co...

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Bibliographische Detailangaben

Hauptverfasser:	Auth, Christopher P, Chikarmane, Vinay, Shin, Jinhong, Yeoh, Andrew W, Steigerwald, Joseph
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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