Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches

Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second p...

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Hauptverfasser: Feng, Hongxia, Guo, Xiaoying, Han, Jung Kyu, Manepalli, Rahul N
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator Feng, Hongxia
Guo, Xiaoying
Han, Jung Kyu
Manepalli, Rahul N
description Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11955448B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11955448B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11955448B23</originalsourceid><addsrcrecordid>eNqNyjEOgjAUBmAWB6Pe4XkABxQSGcVAJNFJHZxIaX9ok1Ka9pHo7V08gNO3fMvkdQpSG4bkOYB4olE4MYDqa0PdPHrSMINmUrAsSDhFAdaIzljDH3KAitRPgUbzhqLq1pTkDUuNuE4WvbARm5-rZFtXj_NlBz-1iF5IOHD7vKdpkedZdiz3h3_OF01jOaY</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches</title><source>esp@cenet</source><creator>Feng, Hongxia ; Guo, Xiaoying ; Han, Jung Kyu ; Manepalli, Rahul N</creator><creatorcontrib>Feng, Hongxia ; Guo, Xiaoying ; Han, Jung Kyu ; Manepalli, Rahul N</creatorcontrib><description>Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240409&amp;DB=EPODOC&amp;CC=US&amp;NR=11955448B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240409&amp;DB=EPODOC&amp;CC=US&amp;NR=11955448B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Feng, Hongxia</creatorcontrib><creatorcontrib>Guo, Xiaoying</creatorcontrib><creatorcontrib>Han, Jung Kyu</creatorcontrib><creatorcontrib>Manepalli, Rahul N</creatorcontrib><title>Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches</title><description>Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyjEOgjAUBmAWB6Pe4XkABxQSGcVAJNFJHZxIaX9ok1Ka9pHo7V08gNO3fMvkdQpSG4bkOYB4olE4MYDqa0PdPHrSMINmUrAsSDhFAdaIzljDH3KAitRPgUbzhqLq1pTkDUuNuE4WvbARm5-rZFtXj_NlBz-1iF5IOHD7vKdpkedZdiz3h3_OF01jOaY</recordid><startdate>20240409</startdate><enddate>20240409</enddate><creator>Feng, Hongxia</creator><creator>Guo, Xiaoying</creator><creator>Han, Jung Kyu</creator><creator>Manepalli, Rahul N</creator><scope>EVB</scope></search><sort><creationdate>20240409</creationdate><title>Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches</title><author>Feng, Hongxia ; Guo, Xiaoying ; Han, Jung Kyu ; Manepalli, Rahul N</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11955448B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Feng, Hongxia</creatorcontrib><creatorcontrib>Guo, Xiaoying</creatorcontrib><creatorcontrib>Han, Jung Kyu</creatorcontrib><creatorcontrib>Manepalli, Rahul N</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Feng, Hongxia</au><au>Guo, Xiaoying</au><au>Han, Jung Kyu</au><au>Manepalli, Rahul N</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches</title><date>2024-04-09</date><risdate>2024</risdate><abstract>Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate and a bridge substrate embedded in the package substrate. In an embodiment, first pads are over the package substrate, where the first pads have a first pitch, and second pads are over the bridge substrate, where the second pads have a second pitch that is smaller than the first pitch. In an embodiment, a barrier layer is over individual ones of the second pads. In an embodiment, reflown solder is over individual ones of the first pads and over individual ones of the second pads. In an embodiment, a first standoff height of the reflown solder over the first pads is equal to a second standoff height of the reflown solder over the second pads.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-07T17%3A31%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Feng,%20Hongxia&rft.date=2024-04-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11955448B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true