Package-integrated multi-turn coil embedded in a package magnetic core

A microelectronics package comprising a substrate, the substrate comprising a dielectric and at least first and second conductor level within the dielectric, where the first and second conductor levels are separated by at least one dielectric layer. The microelectronics package comprises an inductor...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Do, Huong, Radhakrishnan, Kaladhar, Deng, Yikang, Bharath, Krishna, Alur, Amruthavalli P
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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