Film-shaped firing material and film-shaped firing material with a support sheet

A film-shaped firing material (1) is provided, including first metal particles (10), second metal particles (20), and a binder component (30), in which the average particle diameter of the first metal particles (10) is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the...

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Bibliographische Detailangaben
Hauptverfasser:	Ichikawa, Isao, Mori, Takeshi, Nakayama, Hidekazu
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASTING CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING METALLIC POWDER
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Beschreibung
Zusammenfassung:	A film-shaped firing material (1) is provided, including first metal particles (10), second metal particles (20), and a binder component (30), in which the average particle diameter of the first metal particles (10) is 100 nm or less, and the maximum particle diameter thereof is 250 nm or less, the average particle diameter of the second metal particles (20) is in a range of 1000 to 7000 nm, the minimum particle diameter thereof is greater than 250 nm, and the maximum particle diameter thereof is 10000 nm or less, and the mass ratio of the first metal particles to the second metal particles is 0.1 or greater.