Managing thermal resistance and planarity of a display package

Disclosed herein is an LED device that includes a display package and a plurality of LED dies arranged on a top surface of the display package. The display package includes a molding compound, a backplane die, and at least one spacer structure, with the backplane die and the at least one spacer stru...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Pendse, Rajendra D
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!