Method of fabricating reticle
A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device de...
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| creator | Liao, Chi-Hung Chung, Hsueh-Yi Chen, Yung-Cheng Fu, Shih-Chi Chang, Tzong-Sheng Hsu, Wei-Ti Chuang, Jui-Ping Tsai, Fei-Gwo Chen, Kuei-Shun Chen, Meng-Wei |
| description | A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11940737B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11940737B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11940737B23</originalsourceid><addsrcrecordid>eNrjZJD1TS3JyE9RyE9TSEtMKspMTizJzEtXKEotyUzOSeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGliYG5sbmTkbGxKgBAMISJDA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method of fabricating reticle</title><source>esp@cenet</source><creator>Liao, Chi-Hung ; Chung, Hsueh-Yi ; Chen, Yung-Cheng ; Fu, Shih-Chi ; Chang, Tzong-Sheng ; Hsu, Wei-Ti ; Chuang, Jui-Ping ; Tsai, Fei-Gwo ; Chen, Kuei-Shun ; Chen, Meng-Wei</creator><creatorcontrib>Liao, Chi-Hung ; Chung, Hsueh-Yi ; Chen, Yung-Cheng ; Fu, Shih-Chi ; Chang, Tzong-Sheng ; Hsu, Wei-Ti ; Chuang, Jui-Ping ; Tsai, Fei-Gwo ; Chen, Kuei-Shun ; Chen, Meng-Wei</creatorcontrib><description>A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240326&DB=EPODOC&CC=US&NR=11940737B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240326&DB=EPODOC&CC=US&NR=11940737B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Liao, Chi-Hung</creatorcontrib><creatorcontrib>Chung, Hsueh-Yi</creatorcontrib><creatorcontrib>Chen, Yung-Cheng</creatorcontrib><creatorcontrib>Fu, Shih-Chi</creatorcontrib><creatorcontrib>Chang, Tzong-Sheng</creatorcontrib><creatorcontrib>Hsu, Wei-Ti</creatorcontrib><creatorcontrib>Chuang, Jui-Ping</creatorcontrib><creatorcontrib>Tsai, Fei-Gwo</creatorcontrib><creatorcontrib>Chen, Kuei-Shun</creatorcontrib><creatorcontrib>Chen, Meng-Wei</creatorcontrib><title>Method of fabricating reticle</title><description>A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJD1TS3JyE9RyE9TSEtMKspMTizJzEtXKEotyUzOSeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGhwYaGliYG5sbmTkbGxKgBAMISJDA</recordid><startdate>20240326</startdate><enddate>20240326</enddate><creator>Liao, Chi-Hung</creator><creator>Chung, Hsueh-Yi</creator><creator>Chen, Yung-Cheng</creator><creator>Fu, Shih-Chi</creator><creator>Chang, Tzong-Sheng</creator><creator>Hsu, Wei-Ti</creator><creator>Chuang, Jui-Ping</creator><creator>Tsai, Fei-Gwo</creator><creator>Chen, Kuei-Shun</creator><creator>Chen, Meng-Wei</creator><scope>EVB</scope></search><sort><creationdate>20240326</creationdate><title>Method of fabricating reticle</title><author>Liao, Chi-Hung ; Chung, Hsueh-Yi ; Chen, Yung-Cheng ; Fu, Shih-Chi ; Chang, Tzong-Sheng ; Hsu, Wei-Ti ; Chuang, Jui-Ping ; Tsai, Fei-Gwo ; Chen, Kuei-Shun ; Chen, Meng-Wei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11940737B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Liao, Chi-Hung</creatorcontrib><creatorcontrib>Chung, Hsueh-Yi</creatorcontrib><creatorcontrib>Chen, Yung-Cheng</creatorcontrib><creatorcontrib>Fu, Shih-Chi</creatorcontrib><creatorcontrib>Chang, Tzong-Sheng</creatorcontrib><creatorcontrib>Hsu, Wei-Ti</creatorcontrib><creatorcontrib>Chuang, Jui-Ping</creatorcontrib><creatorcontrib>Tsai, Fei-Gwo</creatorcontrib><creatorcontrib>Chen, Kuei-Shun</creatorcontrib><creatorcontrib>Chen, Meng-Wei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Liao, Chi-Hung</au><au>Chung, Hsueh-Yi</au><au>Chen, Yung-Cheng</au><au>Fu, Shih-Chi</au><au>Chang, Tzong-Sheng</au><au>Hsu, Wei-Ti</au><au>Chuang, Jui-Ping</au><au>Tsai, Fei-Gwo</au><au>Chen, Kuei-Shun</au><au>Chen, Meng-Wei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of fabricating reticle</title><date>2024-03-26</date><risdate>2024</risdate><abstract>A method includes receiving a device design layout and a scribe line design layout surrounding the device design layout. The device design layout and the scribe line design layout are rotated in different directions. An optical proximity correction (OPC) process is performed on the rotated device design layout and the rotated scribe line design layout. A reticle includes the device design layout and the scribe line design layout is formed after performing the OPC process.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | Method of fabricating reticle |
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