Micromechanical component for a capacitive pressure sensor device
A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal vo...
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| creator | Senz, Volkmar Hermes, Christoph Artmann, Hans Schmollngruber, Peter Friedrich, Thomas Weber, Heribert |
| description | A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11940345B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11940345B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11940345B23</originalsourceid><addsrcrecordid>eNrjZHD0zUwuys9NTc5IzMtMTsxRSM7PLcjPS80rUUjLL1JIVEhOLEhMzizJLEtVKChKLS4uLUpVKE7NKwZKpqSWZSan8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41GKg7tS81JL40GBDQ0sTA2MTUycjY2LUAABB4DJI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Micromechanical component for a capacitive pressure sensor device</title><source>esp@cenet</source><creator>Senz, Volkmar ; Hermes, Christoph ; Artmann, Hans ; Schmollngruber, Peter ; Friedrich, Thomas ; Weber, Heribert</creator><creatorcontrib>Senz, Volkmar ; Hermes, Christoph ; Artmann, Hans ; Schmollngruber, Peter ; Friedrich, Thomas ; Weber, Heribert</creatorcontrib><description>A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.</description><language>eng</language><subject>MEASURING ; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE ; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PHYSICS ; TESTING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240326&DB=EPODOC&CC=US&NR=11940345B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240326&DB=EPODOC&CC=US&NR=11940345B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Senz, Volkmar</creatorcontrib><creatorcontrib>Hermes, Christoph</creatorcontrib><creatorcontrib>Artmann, Hans</creatorcontrib><creatorcontrib>Schmollngruber, Peter</creatorcontrib><creatorcontrib>Friedrich, Thomas</creatorcontrib><creatorcontrib>Weber, Heribert</creatorcontrib><title>Micromechanical component for a capacitive pressure sensor device</title><description>A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.</description><subject>MEASURING</subject><subject>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</subject><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>TESTING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0zUwuys9NTc5IzMtMTsxRSM7PLcjPS80rUUjLL1JIVEhOLEhMzizJLEtVKChKLS4uLUpVKE7NKwZKpqSWZSan8jCwpiXmFKfyQmluBkU31xBnD93Ugvz41GKg7tS81JL40GBDQ0sTA2MTUycjY2LUAABB4DJI</recordid><startdate>20240326</startdate><enddate>20240326</enddate><creator>Senz, Volkmar</creator><creator>Hermes, Christoph</creator><creator>Artmann, Hans</creator><creator>Schmollngruber, Peter</creator><creator>Friedrich, Thomas</creator><creator>Weber, Heribert</creator><scope>EVB</scope></search><sort><creationdate>20240326</creationdate><title>Micromechanical component for a capacitive pressure sensor device</title><author>Senz, Volkmar ; Hermes, Christoph ; Artmann, Hans ; Schmollngruber, Peter ; Friedrich, Thomas ; Weber, Heribert</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11940345B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>MEASURING</topic><topic>MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE</topic><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>TESTING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Senz, Volkmar</creatorcontrib><creatorcontrib>Hermes, Christoph</creatorcontrib><creatorcontrib>Artmann, Hans</creatorcontrib><creatorcontrib>Schmollngruber, Peter</creatorcontrib><creatorcontrib>Friedrich, Thomas</creatorcontrib><creatorcontrib>Weber, Heribert</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Senz, Volkmar</au><au>Hermes, Christoph</au><au>Artmann, Hans</au><au>Schmollngruber, Peter</au><au>Friedrich, Thomas</au><au>Weber, Heribert</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Micromechanical component for a capacitive pressure sensor device</title><date>2024-03-26</date><risdate>2024</risdate><abstract>A micromechanical component for a capacitive pressure sensor device includes a substrate; a frame structure that frames a partial surface; a membrane that is tensioned by the frame structure such that a self-supporting region of the membrane extends over the framed partial surface and an internal volume with a reference pressure therein is sealed in an airtight fashion, the self-supporting region of the membrane being deformable by a physical pressure on an external side of the self-supporting region that not equal to the reference pressure; a measurement electrode situated on the framed partial surface; and a reference measurement electrode that is situated on the framed partial surface and is electrically insulated from the measurement electrode.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | MEASURING MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS TESTING TRANSPORTING |
| title | Micromechanical component for a capacitive pressure sensor device |
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