Phenolic resin foam laminate board
Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of...
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| creator | Miyata, Narumi Mihori, Hisashi Hiramatsu, Nobuki |
| description | Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 μm and not more than 200 μm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10−3 m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11932733B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11932733B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11932733B23</originalsourceid><addsrcrecordid>eNrjZFAKyEjNy8_JTFYoSi3OzFNIy0_MVchJzM3MSyxJVUjKTyxK4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhoaWxkbmxsZORsbEqAEAoyUmAA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Phenolic resin foam laminate board</title><source>esp@cenet</source><creator>Miyata, Narumi ; Mihori, Hisashi ; Hiramatsu, Nobuki</creator><creatorcontrib>Miyata, Narumi ; Mihori, Hisashi ; Hiramatsu, Nobuki</creatorcontrib><description>Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 μm and not more than 200 μm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10−3 m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; GENERAL PROCESSES OF COMPOUNDING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240319&DB=EPODOC&CC=US&NR=11932733B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240319&DB=EPODOC&CC=US&NR=11932733B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Miyata, Narumi</creatorcontrib><creatorcontrib>Mihori, Hisashi</creatorcontrib><creatorcontrib>Hiramatsu, Nobuki</creatorcontrib><title>Phenolic resin foam laminate board</title><description>Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 μm and not more than 200 μm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10−3 m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAKyEjNy8_JTFYoSi3OzFNIy0_MVchJzM3MSyxJVUjKTyxK4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8aHBhoaWxkbmxsZORsbEqAEAoyUmAA</recordid><startdate>20240319</startdate><enddate>20240319</enddate><creator>Miyata, Narumi</creator><creator>Mihori, Hisashi</creator><creator>Hiramatsu, Nobuki</creator><scope>EVB</scope></search><sort><creationdate>20240319</creationdate><title>Phenolic resin foam laminate board</title><author>Miyata, Narumi ; Mihori, Hisashi ; Hiramatsu, Nobuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11932733B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>Miyata, Narumi</creatorcontrib><creatorcontrib>Mihori, Hisashi</creatorcontrib><creatorcontrib>Hiramatsu, Nobuki</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Miyata, Narumi</au><au>Mihori, Hisashi</au><au>Hiramatsu, Nobuki</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Phenolic resin foam laminate board</title><date>2024-03-19</date><risdate>2024</risdate><abstract>Provided is a phenolic resin foam laminate board in which a flexible surface material is arranged on at least upper and lower surfaces of a phenolic resin foam. The phenolic resin foam contains HCFO-1224yd(Z), has a density of not less than 20 kg/m3 and not more than 55 kg/m3, a closed cell ratio of 80% or more, an average cell diameter of not less than 60 μm and not more than 200 μm, a percentage of an area seeping out from the surface material is 30% or less, and content of HCFO-1224yd(Z) per space volume of 22.4×10−3 m3 in the phenolic resin foam is not less than 0.06 mol and not more than 0.35 mol.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | Phenolic resin foam laminate board |
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