Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods
Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip ha...
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| creator | Louwerse, Marcus Cornelis Weekamp, Johannes Wilhelmus Henneken, Vincent Adrianus Groenland, Alfons Wouter |
| description | Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed. |
| format | Patent |
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A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.</description><language>eng</language><subject>ACOUSTICS ; ACOUSTICS NOT OTHERWISE PROVIDED FOR ; DIAGNOSIS ; ELECTRICITY ; FOR PERFORMING MECHANICAL WORK IN GENERAL ; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL ; HUMAN NECESSITIES ; HYGIENE ; IDENTIFICATION ; MEDICAL OR VETERINARY SCIENCE ; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY ; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL ; MUSICAL INSTRUMENTS ; PERFORMING OPERATIONS ; PHYSICS ; SOUND-PRODUCING DEVICES ; SURGERY ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240319&DB=EPODOC&CC=US&NR=11931777B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240319&DB=EPODOC&CC=US&NR=11931777B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Louwerse, Marcus Cornelis</creatorcontrib><creatorcontrib>Weekamp, Johannes Wilhelmus</creatorcontrib><creatorcontrib>Henneken, Vincent Adrianus</creatorcontrib><creatorcontrib>Groenland, Alfons Wouter</creatorcontrib><title>Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods</title><description>Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.</description><subject>ACOUSTICS</subject><subject>ACOUSTICS NOT OTHERWISE PROVIDED FOR</subject><subject>DIAGNOSIS</subject><subject>ELECTRICITY</subject><subject>FOR PERFORMING MECHANICAL WORK IN GENERAL</subject><subject>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</subject><subject>HUMAN NECESSITIES</subject><subject>HYGIENE</subject><subject>IDENTIFICATION</subject><subject>MEDICAL OR VETERINARY SCIENCE</subject><subject>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</subject><subject>METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL</subject><subject>MUSICAL INSTRUMENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SOUND-PRODUCING DEVICES</subject><subject>SURGERY</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjLsOgkAQRWksjPoPY68FUhBbjMZeqcmwDLDJvrKzW_AHfraAj1ha3Zubc-4yeZQqeGRrpICxGG6iIA-ilw6QmXSthh3EFxRNA87bmr7LpEmNnTQd8MCBNOAI_fCfk3mfZdBoYosiRD9pmkJvG14nixYV0-adq2R7Od9P1z05WxE7FGQoVOUtTY9Zmud5ccj-YZ7Opk4L</recordid><startdate>20240319</startdate><enddate>20240319</enddate><creator>Louwerse, Marcus Cornelis</creator><creator>Weekamp, Johannes Wilhelmus</creator><creator>Henneken, Vincent Adrianus</creator><creator>Groenland, Alfons Wouter</creator><scope>EVB</scope></search><sort><creationdate>20240319</creationdate><title>Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods</title><author>Louwerse, Marcus Cornelis ; Weekamp, Johannes Wilhelmus ; Henneken, Vincent Adrianus ; Groenland, Alfons Wouter</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11931777B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ACOUSTICS</topic><topic>ACOUSTICS NOT OTHERWISE PROVIDED FOR</topic><topic>DIAGNOSIS</topic><topic>ELECTRICITY</topic><topic>FOR PERFORMING MECHANICAL WORK IN GENERAL</topic><topic>GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL</topic><topic>HUMAN NECESSITIES</topic><topic>HYGIENE</topic><topic>IDENTIFICATION</topic><topic>MEDICAL OR VETERINARY SCIENCE</topic><topic>METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY</topic><topic>METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL</topic><topic>MUSICAL INSTRUMENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SOUND-PRODUCING DEVICES</topic><topic>SURGERY</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Louwerse, Marcus Cornelis</creatorcontrib><creatorcontrib>Weekamp, Johannes Wilhelmus</creatorcontrib><creatorcontrib>Henneken, Vincent Adrianus</creatorcontrib><creatorcontrib>Groenland, Alfons Wouter</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Louwerse, Marcus Cornelis</au><au>Weekamp, Johannes Wilhelmus</au><au>Henneken, Vincent Adrianus</au><au>Groenland, Alfons Wouter</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods</title><date>2024-03-19</date><risdate>2024</risdate><abstract>Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact. An ultrasound probe including such an assembly, an ultrasonic imaging system including such an ultrasound probes and manufacturing methods of such an assembly and probe are also disclosed.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ACOUSTICS ACOUSTICS NOT OTHERWISE PROVIDED FOR DIAGNOSIS ELECTRICITY FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL HUMAN NECESSITIES HYGIENE IDENTIFICATION MEDICAL OR VETERINARY SCIENCE METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL MUSICAL INSTRUMENTS PERFORMING OPERATIONS PHYSICS SOUND-PRODUCING DEVICES SURGERY TRANSPORTING |
| title | Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods |
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