Multi-site concurrent wafer probe magnetic circuit testing

Multi-site concurrent wafer probe magnetic circuit testing

A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer pl...

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Hauptverfasser: Huang, Xinkun, Lee, Dok Won, Solomon, Roy Deidrick, Ledbetter, Christopher Michael, Dahl, Bret Alan
Format: Patent
Sprache:eng
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MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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creator Huang, Xinkun
Lee, Dok Won
Solomon, Roy Deidrick
Ledbetter, Christopher Michael
Dahl, Bret Alan
description A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11927604B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11927604B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11927604B23</originalsourceid><addsrcrecordid>eNrjZLDyLc0pydQtzixJVUjOz0suLSpKzStRKE9MSy1SKCjKT0pVyE1Mz0styUxWSM4sSi7NLFEoSS0uycxL52FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpQH3xocGGhpZG5mYGJk5GxsSoAQCtpy-n</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Multi-site concurrent wafer probe magnetic circuit testing</title><source>esp@cenet</source><creator>Huang, Xinkun ; Lee, Dok Won ; Solomon, Roy Deidrick ; Ledbetter, Christopher Michael ; Dahl, Bret Alan</creator><creatorcontrib>Huang, Xinkun ; Lee, Dok Won ; Solomon, Roy Deidrick ; Ledbetter, Christopher Michael ; Dahl, Bret Alan</creatorcontrib><description>A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.</description><language>eng</language><subject>MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240312&amp;DB=EPODOC&amp;CC=US&amp;NR=11927604B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240312&amp;DB=EPODOC&amp;CC=US&amp;NR=11927604B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Huang, Xinkun</creatorcontrib><creatorcontrib>Lee, Dok Won</creatorcontrib><creatorcontrib>Solomon, Roy Deidrick</creatorcontrib><creatorcontrib>Ledbetter, Christopher Michael</creatorcontrib><creatorcontrib>Dahl, Bret Alan</creatorcontrib><title>Multi-site concurrent wafer probe magnetic circuit testing</title><description>A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.</description><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDyLc0pydQtzixJVUjOz0suLSpKzStRKE9MSy1SKCjKT0pVyE1Mz0styUxWSM4sSi7NLFEoSS0uycxL52FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpQH3xocGGhpZG5mYGJk5GxsSoAQCtpy-n</recordid><startdate>20240312</startdate><enddate>20240312</enddate><creator>Huang, Xinkun</creator><creator>Lee, Dok Won</creator><creator>Solomon, Roy Deidrick</creator><creator>Ledbetter, Christopher Michael</creator><creator>Dahl, Bret Alan</creator><scope>EVB</scope></search><sort><creationdate>20240312</creationdate><title>Multi-site concurrent wafer probe magnetic circuit testing</title><author>Huang, Xinkun ; Lee, Dok Won ; Solomon, Roy Deidrick ; Ledbetter, Christopher Michael ; Dahl, Bret Alan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11927604B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Huang, Xinkun</creatorcontrib><creatorcontrib>Lee, Dok Won</creatorcontrib><creatorcontrib>Solomon, Roy Deidrick</creatorcontrib><creatorcontrib>Ledbetter, Christopher Michael</creatorcontrib><creatorcontrib>Dahl, Bret Alan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Huang, Xinkun</au><au>Lee, Dok Won</au><au>Solomon, Roy Deidrick</au><au>Ledbetter, Christopher Michael</au><au>Dahl, Bret Alan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Multi-site concurrent wafer probe magnetic circuit testing</title><date>2024-03-12</date><risdate>2024</risdate><abstract>A wafer probe test system having a probe card with a probe head, a rotary magnet, a magnetic sensor positioned to sense the magnetic field of the rotary magnet and a controller coupled to the probe card, where the probe head has probe needles to engage features of test sites of a wafer in a wafer plane of orthogonal first and second directions, and the rotary magnet is rotatable around an axis of a third direction to provide a magnetic field to the wafer, in which the controller includes a model of magnetic flux density in the first, second and third directions at the respective test sites of the wafer as a function of a rotational angle of the rotary magnet, a probe needle height along the third direction and a measured magnetic flux density of the magnetic sensor.</abstract><oa>free_for_read</oa></addata></record>
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subjects MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
title Multi-site concurrent wafer probe magnetic circuit testing
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-26T01%3A33%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Huang,%20Xinkun&rft.date=2024-03-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11927604B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true