High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same
A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1p-L1x-M2q-L2y-M3r-L3z-A-...
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| creator | Lee, Mooho Pang, Kyeong Won, Jonghoon Hyun, Songwon Lee, Hyejeong Kim, In |
| description | A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description. |
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The epoxy compound has a structure represented by Formula 1.E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.</description><language>eng</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240312&DB=EPODOC&CC=US&NR=11926695B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240312&DB=EPODOC&CC=US&NR=11926695B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lee, Mooho</creatorcontrib><creatorcontrib>Pang, Kyeong</creatorcontrib><creatorcontrib>Won, Jonghoon</creatorcontrib><creatorcontrib>Hyun, Songwon</creatorcontrib><creatorcontrib>Lee, Hyejeong</creatorcontrib><creatorcontrib>Kim, In</creatorcontrib><title>High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same</title><description>A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. 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Pang, Kyeong ; Won, Jonghoon ; Hyun, Songwon ; Lee, Hyejeong ; Kim, In</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11926695B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>Lee, Mooho</creatorcontrib><creatorcontrib>Pang, Kyeong</creatorcontrib><creatorcontrib>Won, Jonghoon</creatorcontrib><creatorcontrib>Hyun, Songwon</creatorcontrib><creatorcontrib>Lee, Hyejeong</creatorcontrib><creatorcontrib>Kim, In</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lee, Mooho</au><au>Pang, Kyeong</au><au>Won, Jonghoon</au><au>Hyun, Songwon</au><au>Lee, Hyejeong</au><au>Kim, In</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same</title><date>2024-03-12</date><risdate>2024</risdate><abstract>A high-thermal conductive epoxy compound and a composition, a material for a semiconductor package, a molded product, an electric and electronic device, and a semiconductor package including the epoxy compound. The epoxy compound has a structure represented by Formula 1.E1-M1p-L1x-M2q-L2y-M3r-L3z-A-L3z-M3r-L2y-M2q-L1x-M1p-E2 Formula 1In Formula 1, M1, M2, M3, L1, L2, L3, A, E, p, q, r, x, y, and z are the same as defined in the detailed description.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same |
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