Lead-frame assembly, semiconductor package and methods for improved adhesion

A lead-frame assembly is disclosed, for a semiconductor die and comprising a die attach pad and a plurality of elongate leads spaced apart therefrom; wherein each elongate lead has a first proximal end portion, a second distal end portion and a middle portion therebetween; wherein the die attach pad...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Descartin, Allen Marfil, Ching, Jr., Mariano Layson, Li, Jun
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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