Three-dimensional semiconductor memory device

A three-dimensional semiconductor memory device may include a first stack block including first stacks arranged in a first direction on a substrate, a second stack block including second stacks arranged in the first direction on the substrate, and a separation structure provided on the substrate bet...

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Hauptverfasser: Lim, Geunwon, Kim, Junhyoung, Cheon, Jisung, Kim, Kwang-Soo
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creator Lim, Geunwon
Kim, Junhyoung
Cheon, Jisung
Kim, Kwang-Soo
description A three-dimensional semiconductor memory device may include a first stack block including first stacks arranged in a first direction on a substrate, a second stack block including second stacks arranged in the first direction on the substrate, and a separation structure provided on the substrate between the first stack block and the second stack block. The separation structure may include first mold layers and second mold layers, which are stacked in a vertical direction perpendicular to a top surface of the substrate.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Three-dimensional semiconductor memory device
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