Three-dimensional semiconductor memory device
A three-dimensional semiconductor memory device may include a first stack block including first stacks arranged in a first direction on a substrate, a second stack block including second stacks arranged in the first direction on the substrate, and a separation structure provided on the substrate bet...
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creator | Lim, Geunwon Kim, Junhyoung Cheon, Jisung Kim, Kwang-Soo |
description | A three-dimensional semiconductor memory device may include a first stack block including first stacks arranged in a first direction on a substrate, a second stack block including second stacks arranged in the first direction on the substrate, and a separation structure provided on the substrate between the first stack block and the second stack block. The separation structure may include first mold layers and second mold layers, which are stacked in a vertical direction perpendicular to a top surface of the substrate. |
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The separation structure may include first mold layers and second mold layers, which are stacked in a vertical direction perpendicular to a top surface of the substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=US&NR=11917819B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240227&DB=EPODOC&CC=US&NR=11917819B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lim, Geunwon</creatorcontrib><creatorcontrib>Kim, Junhyoung</creatorcontrib><creatorcontrib>Cheon, Jisung</creatorcontrib><creatorcontrib>Kim, Kwang-Soo</creatorcontrib><title>Three-dimensional semiconductor memory device</title><description>A three-dimensional semiconductor memory device may include a first stack block including first stacks arranged in a first direction on a substrate, a second stack block including second stacks arranged in the first direction on the substrate, and a separation structure provided on the substrate between the first stack block and the second stack block. The separation structure may include first mold layers and second mold layers, which are stacked in a vertical direction perpendicular to a top surface of the substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANyShKTdVNycxNzSvOzM9LzFEoTs3NTM7PSylNLskvUshNzc0vqlRISS3LTE7lYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGhpaG5haGlk5GxsSoAQAKbCry</recordid><startdate>20240227</startdate><enddate>20240227</enddate><creator>Lim, Geunwon</creator><creator>Kim, Junhyoung</creator><creator>Cheon, Jisung</creator><creator>Kim, Kwang-Soo</creator><scope>EVB</scope></search><sort><creationdate>20240227</creationdate><title>Three-dimensional semiconductor memory device</title><author>Lim, Geunwon ; Kim, Junhyoung ; Cheon, Jisung ; Kim, Kwang-Soo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11917819B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Lim, Geunwon</creatorcontrib><creatorcontrib>Kim, Junhyoung</creatorcontrib><creatorcontrib>Cheon, Jisung</creatorcontrib><creatorcontrib>Kim, Kwang-Soo</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lim, Geunwon</au><au>Kim, Junhyoung</au><au>Cheon, Jisung</au><au>Kim, Kwang-Soo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Three-dimensional semiconductor memory device</title><date>2024-02-27</date><risdate>2024</risdate><abstract>A three-dimensional semiconductor memory device may include a first stack block including first stacks arranged in a first direction on a substrate, a second stack block including second stacks arranged in the first direction on the substrate, and a separation structure provided on the substrate between the first stack block and the second stack block. The separation structure may include first mold layers and second mold layers, which are stacked in a vertical direction perpendicular to a top surface of the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Three-dimensional semiconductor memory device |
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