Package structure and manufacturing method thereof

A packaging structure including first, second, and third dies, an encapsulant, a circuit structure, and a filler is provided. The encapsulant covers the first die. The circuit structure is disposed on the encapsulant. The second die is disposed on the circuit structure and is electrically connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lin, Nan-Chun, Hsu, Hung-Hsin, Chang Chien, Shang-Yu
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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