Packaged semiconductor device assembly

A semiconductor device comprises a substrate including a set of interconnect pads, a die mounted on the substrate, wherein the die includes circuitry that cannot withstand typical lead-free (Pb-free) solder reflow temperature during reflow process, and a reinforcing interposer including a first set...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Singh, Akhilesh Kumar, Mahatme, Nihaar N, Lakhera, Nishant, Foong, Chee Seng, Mawer, Andrew Jefferson
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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