Printed circuit board
A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each...
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| creator | Lee, Won Seok Park, Jin Oh Kim, Chi Seong Lee, Jin Uk Lim, Guh Hwan |
| description | A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11903129B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11903129B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11903129B23</originalsourceid><addsrcrecordid>eNrjZBANKMrMK0lNUUjOLEouzSxRSMpPLErhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGhpYGxoZGlk5GxsSoAQB0PyE1</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Printed circuit board</title><source>esp@cenet</source><creator>Lee, Won Seok ; Park, Jin Oh ; Kim, Chi Seong ; Lee, Jin Uk ; Lim, Guh Hwan</creator><creatorcontrib>Lee, Won Seok ; Park, Jin Oh ; Kim, Chi Seong ; Lee, Jin Uk ; Lim, Guh Hwan</creatorcontrib><description>A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240213&DB=EPODOC&CC=US&NR=11903129B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240213&DB=EPODOC&CC=US&NR=11903129B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Lee, Won Seok</creatorcontrib><creatorcontrib>Park, Jin Oh</creatorcontrib><creatorcontrib>Kim, Chi Seong</creatorcontrib><creatorcontrib>Lee, Jin Uk</creatorcontrib><creatorcontrib>Lim, Guh Hwan</creatorcontrib><title>Printed circuit board</title><description>A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBANKMrMK0lNUUjOLEouzSxRSMpPLErhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxocGGhpYGxoZGlk5GxsSoAQB0PyE1</recordid><startdate>20240213</startdate><enddate>20240213</enddate><creator>Lee, Won Seok</creator><creator>Park, Jin Oh</creator><creator>Kim, Chi Seong</creator><creator>Lee, Jin Uk</creator><creator>Lim, Guh Hwan</creator><scope>EVB</scope></search><sort><creationdate>20240213</creationdate><title>Printed circuit board</title><author>Lee, Won Seok ; Park, Jin Oh ; Kim, Chi Seong ; Lee, Jin Uk ; Lim, Guh Hwan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11903129B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Lee, Won Seok</creatorcontrib><creatorcontrib>Park, Jin Oh</creatorcontrib><creatorcontrib>Kim, Chi Seong</creatorcontrib><creatorcontrib>Lee, Jin Uk</creatorcontrib><creatorcontrib>Lim, Guh Hwan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Lee, Won Seok</au><au>Park, Jin Oh</au><au>Kim, Chi Seong</au><au>Lee, Jin Uk</au><au>Lim, Guh Hwan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Printed circuit board</title><date>2024-02-13</date><risdate>2024</risdate><abstract>A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | Printed circuit board |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T15%3A24%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Lee,%20Won%20Seok&rft.date=2024-02-13&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11903129B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |