Semiconductor package

A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a second semiconductor chip disposed on a top surface of the first semiconductor chip, an insulating layer surrounding the first and second semiconductor chips...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Song, Eunseok, Oh, Kyung Suk
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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