Sharing package pins in a multi-chip module (MCM)

A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Hong, Chen-Kuan, Huang, Tyrone Tung, Shen, Yulei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	Hong, Chen-Kuan Huang, Tyrone Tung Shen, Yulei
description	A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11886370B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11886370B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11886370B23</originalsourceid><addsrcrecordid>eNrjZDAMzkgsysxLVyhITM5OTE9VKMjMK1bIzFNIVMgtzSnJ1E3OyCxQyM1PKc1JVdDwdfbV5GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAc1LzUkviQ4MNDS0szIzNDZyMjIlRAwAIJypq</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Sharing package pins in a multi-chip module (MCM)</title><source>esp@cenet</source><creator>Hong, Chen-Kuan ; Huang, Tyrone Tung ; Shen, Yulei</creator><creatorcontrib>Hong, Chen-Kuan ; Huang, Tyrone Tung ; Shen, Yulei</creatorcontrib><description>A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240130&DB=EPODOC&CC=US&NR=11886370B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240130&DB=EPODOC&CC=US&NR=11886370B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Hong, Chen-Kuan</creatorcontrib><creatorcontrib>Huang, Tyrone Tung</creatorcontrib><creatorcontrib>Shen, Yulei</creatorcontrib><title>Sharing package pins in a multi-chip module (MCM)</title><description>A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAMzkgsysxLVyhITM5OTE9VKMjMK1bIzFNIVMgtzSnJ1E3OyCxQyM1PKc1JVdDwdfbV5GFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcVAc1LzUkviQ4MNDS0szIzNDZyMjIlRAwAIJypq</recordid><startdate>20240130</startdate><enddate>20240130</enddate><creator>Hong, Chen-Kuan</creator><creator>Huang, Tyrone Tung</creator><creator>Shen, Yulei</creator><scope>EVB</scope></search><sort><creationdate>20240130</creationdate><title>Sharing package pins in a multi-chip module (MCM)</title><author>Hong, Chen-Kuan ; Huang, Tyrone Tung ; Shen, Yulei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11886370B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Hong, Chen-Kuan</creatorcontrib><creatorcontrib>Huang, Tyrone Tung</creatorcontrib><creatorcontrib>Shen, Yulei</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Hong, Chen-Kuan</au><au>Huang, Tyrone Tung</au><au>Shen, Yulei</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Sharing package pins in a multi-chip module (MCM)</title><date>2024-01-30</date><risdate>2024</risdate><abstract>A semiconductor package includes multiple dies that share the same package pin. An output enable register provided on each die is used to select the die that drives an output to the shared pin. A hardware arbitration circuit ensures that two or more dies do not drive an output to the shared pin at the same time.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng
recordid	cdi_epo_espacenet_US11886370B2
source	esp@cenet
subjects	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
title	Sharing package pins in a multi-chip module (MCM)
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-30T00%3A08%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Hong,%20Chen-Kuan&rft.date=2024-01-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11886370B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true