Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof

Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to for...

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Bibliographische Detailangaben

Hauptverfasser:	Zhao, Bojie, Tanaka, Takehiko, Guo, Nan, Mei, Zhewen
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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