Method of manufacturing a semiconductor device and semiconductor wafer

A method of manufacturing a semiconductor device is provided. The method includes forming a carbon structure on a handle substrate at a first surface of the handle substrate. The method further includes attaching a first surface of a semiconductor substrate to the first surface of the handle substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Santos Rodriguez, Francisco Javier, Rupp, Roland, Schulze, Hans-Joachim
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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