Controlling plating electrolyte concentration on an electrochemical plating apparatus

Methods and electroplating systems for controlling plating electrolyte concentration on an electrochemical plating apparatus for substrates are disclosed. A method involves: (a) providing an electroplating solution to an electroplating system; (b) electroplating the metal onto the substrate while th...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	He, Zhian, Ma, Quan, Sweeney, Cian, Karim, Rezaul, Nguyen, Quang, Hur, Hyungjun, Ghongadi, Shantinath, Feng, Jingbin
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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